Chemically amplified positive resist composition and resist pattern forming process
US-12164231-B2 · Dec 10, 2024 · US
US8940474B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8940474-B2 |
| Application number | US-201313855751-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 3, 2013 |
| Priority date | Nov 18, 2010 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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A silicate-free alkaline aqueous developer composition has a pH of at least 12 and comprises a hydroxide alkali agent, a metal cation M 2+ selected from barium, calcium, strontium, and zinc cations, a chelating agent for the metal cation, and an alkali metal salt that is different than the other components. These developer compositions can be used to process imaged positive-working lithographic printing plate precursors to prepare lithographic printing plates.
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The invention claimed is: 1. A method for providing a lithographic printing plate comprising: A) imagewise exposing a positive-working lithographic printing plate precursor having an imageable layer to provide exposed and non-exposed regions using infrared radiation, wherein the imageable layer comprises an infrared radiation absorbing compound and a primary polymeric binder in an amount of at least 40 weight % and up to and including 95 weight %, based on the total dry weight…
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