Tin-plated copper-alloy material for terminal and method for producing the same

Patent metadata

Field	Value
Publication number	US-8940404-B2
Application number	US-201313746512-A
Country	US
Kind code	B2
Filing date	Jan 22, 2013
Priority date	Jan 26, 2012
Publication date	Jan 27, 2015
Grant date	Jan 27, 2015

Abstract

Tin-plated copper-alloy material for terminal having: a substrate made of Cu or Cu alloy; an Sn-based surface layer formed on a surface of the substrate; and a Cu—Ni—Sn alloy layer including Ni formed between the Sn-based surface layer and the substrate, in which the Cu—Ni—Sn alloy layer is made of: fine Cu—Ni—Sn alloy particles; and coarse Cu—Ni—Sn alloy particles, an average thickness of the Sn-based surface layer is not less than 0.2 μm and not more than 0.6 μm, an area ratio of the Cu—Ni—Sn alloy layer exposed at a surface of the Sn-based surface layer is not less than 10% and not more than 40%, and a coefficient of kinetic friction of the tin-plated copper-alloy material for terminal is not more than 0.3.

First claim

What is claimed is:

1. A tin-plated copper-alloy material for terminal comprising:
a substrate made of Cu or Cu alloy;
an Sn-based surface layer formed on a surface of the substrate; and
a Cu—Ni—Sn alloy layer including Ni formed between the Sn-based surface layer and the substrate, wherein
the Cu—Ni—Sn alloy layer is made of: fine Cu—Ni—Sn alloy particles containing Ni not less than 10 at % and not more than 40 at % in a state of column crystal having a cross-sectional diam…

Assignees

• Mitsubishi Materials Corp

Inventors

• TANINOUCHI Yuki
• Kato Naoki
• Kubota Kenji

Classifications

• C22C9/02

  Chemistry & Metallurgy · mapped topic

• C25D3/30

  Chemistry & Metallurgy · mapped topic

• B32B15/01 Primary

  Operations & Transport · mapped topic

• Y10T428/12063

  Cross-Sectional Technologies · mapped topic

• C25D3/12

  Chemistry & Metallurgy · mapped topic