Polyamide resin composition

US8940379B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8940379-B2
Application numberUS-201213439577-A
CountryUS
Kind codeB2
Filing dateApr 4, 2012
Priority dateMay 31, 2006
Publication dateJan 27, 2015
Grant dateJan 27, 2015

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Abstract

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A polyamide resin composition contains a resin component containing at least a polyamide, a fatty acid metallic salt having from 10 to 50 carbon atoms, and an additive. The polyamide is obtained through melt polycondensation of a diamine component containing 70% by mol or more of m-xylylenediamine and a dicarboxylic acid component containing 70% by mol or more of an α,ω-linear aliphatic dicarboxylic acid. The additive is at least one compound selected from the group consisting of a diamide compound obtained from a fatty acid having from 8 to 30 carbon atoms and a diamine having from 2 to 10 carbon atoms, a diester compound obtained from a fatty acid having from 8 to 30 carbon atoms and a diol having from 2 to 10 carbon atoms, and a surfactant.

First claim

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What is claimed is: 1. A polyamide resin composition comprising: a resin component containing a polyamide (X) obtained through melt polycondensation of a diamine component containing 70% by mol or more of m-xylylenediamine and a dicarboxylic acid component containing 70% by mol or more of an α,ω-linear aliphatic dicarboxylic acid, a fatty acid metallic salt having from 10 to 50 carbon atoms, and an additive (A), wherein the additive (A) is a surfactant, wherein the surfactant is a nonionic surfactant which is polyoxyethylenesorbitan monolaurate and has a kinematic viscosity of 200 to 1,000 mm 2 /s at 25° C., and wherein an addition amount of the nonionic surfactant in the polyamide resin composition is 50 to 200 ppm, and wherein the half crystallization time of the polyamide (X) at 160° C. is from 10 to 1,600 s and the melting point of the polyamide (X) is from 200 to 265° C. 2. The polyamide resin composition as claimed in claim 1 , wherein the polyamide (X) is a polyamide obtained through polycondensation of a diamine component containing 70% by mol or more of m-xylylenediamine and a dicarboxylic acid component containing 70% by mol or more of an α,ω-linear aliphatic dicarboxylic acid having from 4 to 20 carbon atoms and from 1 to 20% by mol of isophthalic acid. 3. The polyamide resin composition as claimed in claim 1 , wherein said fatty acid metallic salt is calcium stearate. 4. The polyamide resin composition as claimed in claim 1 , wherein said fatty acid metallic salt is included in the polyamide resin composition in an amount of 50 to 5,000 ppm. 5. The polyamide resin composition as claimed in claim 1 , wherein the polyamide (X) has been obtained through said melt polycondensation, in the presence of a phosphorus atom-containing compound. 6. The polyamide resin composition as claimed in claim 1 , wherein said melt polycondensation has been conducted in the presence of both a phosphorus atom-containing compound and an alkali metal compound. 7. A multilayer structure comprising a barrier layer comprising the resin composition as claimed in claim 1 . 8. The multilayer structure as claimed in claim 7 , wherein the structure further comprises a layer mainly comprising a polyester. 9. The multilayer structure as claimed in claim 7 , wherein the structure further comprises a layer mainly comprising a polyolefin. 10. The multilayer structure as claimed in claim 7 , wherein the structure further comprises a layer mainly comprising an aliphatic polyamide. 11. The multilayer structure as claimed in claim 8 , wherein the polyester is a thermoplastic polyester resin obtained through polymerization reaction of a dicarboxylic acid component containing terephthalic acid in an amount of 80% by mol or more, and a diol component containing ethylene glycol in an amount of 80% by mol or more. 12. The multilayer structure as claimed in claim 11 , wherein the structure is a multilayer bottle having a three-layer structure including polyester layer/barrier layer/polyester layer. 13. The multilayer structure as claimed in claim 11 , wherein the structure is a multilayer bottle having a five-layer structure including polyester layer/barrier layer/polyester layer/barrier layer/polyester layer. 14. The multilayer structure as claimed in claim 7 , wherein a weight of the barrier layer is from 1 to 20% by weight based on the total weight of the multilayer structure. 15. The polyamide resin composition as claimed in claim 1 , wherein the additive (A) additionally includes at least one compound selected from the group consisting of a diamide compound obtained from a fatty acid having from 8 to 30 carbon atoms and a diamine having from 2 to 10 carbon atoms, and a diester compound obtained from a fatty acid having from 8 to 30 carbon atoms and a diol having from 2 to 10 carbon atoms. 16. The polyamide resin composition as claimed in claim 1 , wherein said kinematic viscosity of the nonionic surfactant is from 250 to 500 mm 2 /s at 25° C. 17. The polyamide resin composition as claimed in claim 1 , wherein addition amount of the fatty acid metallic salt is from 100 to 1,000 ppm, in the polyamide resin composition.

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What does patent US8940379B2 cover?
A polyamide resin composition contains a resin component containing at least a polyamide, a fatty acid metallic salt having from 10 to 50 carbon atoms, and an additive. The polyamide is obtained through melt polycondensation of a diamine component containing 70% by mol or more of m-xylylenediamine and a dicarboxylic acid component containing 70% by mol or more of an α,ω-linear aliphatic dicarbo…
Who is the assignee on this patent?
Otaki Ryoji, Mitadera Jun, Kato Tomonori, and 2 more
What technology area does this patent fall under?
Primary CPC classification C08K5/0008. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).