Electrodes with electrospun fibers

US8940194B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8940194-B2
Application numberUS-201113214570-A
CountryUS
Kind codeB2
Filing dateAug 22, 2011
Priority dateAug 20, 2010
Publication dateJan 27, 2015
Grant dateJan 27, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In accordance with various example embodiments, an apparatus includes two or more circuit nodes and a conductive material that is located between and configured to electrically couple the circuit nodes. The conductive material includes a network of elongated portions of at least one electrospun Cu-based nanostructure. Each elongated portion has an aspect ratio of at least 50,000 and a length that is greater than 100 microns, and at least one fused crossing point that joins with a fused crossing point of another of the elongated portions. The network of elongated portions is distributed and aligned in the conductive material to set a conductance level and a transparency level along the network, along at least one direction.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus comprising: at least two circuit nodes; and a conductive material configured and arranged to electrically couple said at least two circuit nodes, the conductive material including a network of elongated portions of at least one electrospun Cu-based nanostructure for an article that provides conductive and transparent attributes, each of the elongated portions having the conductive and transparent attributes being provided by an aspect ratio o…

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What does patent US8940194B2 cover?
In accordance with various example embodiments, an apparatus includes two or more circuit nodes and a conductive material that is located between and configured to electrically couple the circuit nodes. The conductive material includes a network of elongated portions of at least one electrospun Cu-based nanostructure. Each elongated portion has an aspect ratio of at least 50,000 and a length th…
Who is the assignee on this patent?
Cui Yi, Wu Hui, Hu Liangbing, and 1 more
What technology area does this patent fall under?
Primary CPC classification H10D84/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).