Resin composition and article made therefrom
US-11897973-B2 · Feb 13, 2024 · US
Insulating layer composition for substrate, and prepreg and substrate using the same
US8940186B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8940186-B2 |
| Application number | US-201213657296-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 22, 2012 |
| Priority date | Oct 25, 2011 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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Abstract
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Disclosed herein are an insulating layer composition for a substrate, including a soluble type liquid crystal thermosetting oligomer, a metal alkoxide compound, and graphene oxide, and an insulating film and a substrate using the same. The insulating layer composition according to the present invention can effectively lower a coefficient of thermal expansion thereof, and thus, a dimensional change due to heat can be minimized when the insulating layer composition is used as an insulation material of the substrate, resulting in a substrate having improved thermal stability.
First claim
Opening claim text (preview).
What is claimed is: 1. An insulating layer composition for a substrate, comprising a soluble liquid crystal thermosetting oligomer, a metal alkoxide compound, and graphene oxide. 2. The insulating layer composition for a substrate according to claim 1 , wherein the soluble liquid crystal thermosetting oligomer is a compound expressed by Formula 1, wherein,…
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Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8940186B2 cover?
- Disclosed herein are an insulating layer composition for a substrate, including a soluble type liquid crystal thermosetting oligomer, a metal alkoxide compound, and graphene oxide, and an insulating film and a substrate using the same. The insulating layer composition according to the present invention can effectively lower a coefficient of thermal expansion thereof, and thus, a dimension…
- Who is the assignee on this patent?
- Samsung Electro Mech
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0353. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).