Method for making microstructure on substrate
US-2015376777-A1 · Dec 31, 2015 · US
Thin film application device and method for coating small aperture vacuum vessels
US8940140B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8940140-B2 |
| Application number | US-85040907-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 5, 2007 |
| Priority date | Sep 5, 2007 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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Abstract
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A device and method for coating an inside surface of a vessel is provided. In one embodiment, a coating device comprises a power supply and a diode in electrical communication with the power supply, wherein electrodes comprising the diode reside completely within the vessel. The method comprises reversibly sealing electrodes in a vessel, sputtering elemental metal or metal compound on the surface while maintaining the surface in a controlled atmosphere.
First claim
Opening claim text (preview).
The embodiment of the invention in which an exclusive property or privilege is claimed is defined as follows: 1. A system for coating an inside surface of a vessel having an inner diameter less than 15 millimeters, the system consisting of comprising: a. an alternating current power supply generating an alternating current; b. a cathode having a first longitudinal axis substantially parallel to a longest length of the vessel and having an interior channel formed therein which ru…
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Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
- C23C14/046Primary
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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- What does patent US8940140B2 cover?
- A device and method for coating an inside surface of a vessel is provided. In one embodiment, a coating device comprises a power supply and a diode in electrical communication with the power supply, wherein electrodes comprising the diode reside completely within the vessel. The method comprises reversibly sealing electrodes in a vessel, sputtering elemental metal or metal compound on the surfa…
- Who is the assignee on this patent?
- Walters Dean R, Este Grantley O, Uchicago Argonne Llc
- What technology area does this patent fall under?
- Primary CPC classification C23C14/046. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).