Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
US8940101B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8940101-B2 |
| Application number | US-201113243954-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 23, 2011 |
| Priority date | Jun 14, 2011 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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An apparatus for cleaning a substrate is disclosed. The apparatus includes a first chamber through which a substrate is conveyed, a second chamber where an oxide film formed on the substrate conveyed from the first chamber is removed; and a third chamber that discharges the substrate conveyed from the second chamber to the outside after rinsing the substrate, wherein the first chamber and the third chamber are disposed on top and on bottom.
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a flat panel display, the method comprising: receiving, at a first chamber, a substrate to be cleaned, wherein an oxide film is formed on the substrate; first transferring the substrate from the first chamber to a second chamber; removing, at the second chamber, the oxide film from the substrate; rinsing the substrate; second transferring the rinsed substrate to a third chamber; and discharging the substrate from the third…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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