Chemical mechanical polishing method
US-2015375361-A1 · Dec 31, 2015 · US
Polishing pad
US8939818B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8939818-B2 |
| Application number | US-201113579527-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 24, 2011 |
| Priority date | Feb 25, 2010 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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Abstract
Official abstract text for this publication.
An object of the invention is to provide a polishing pad which has a polishing layer with a phase-separated structure and can provide high polishing rate and high planarization property and with which scratching can be suppressed. The polishing pad comprises the polishing layer. The polishing layer comprises a product of curing reaction of a polyurethane-forming raw material composition containing: (A) an isocyanate-terminated prepolymer obtained by reaction of a prepolymer-forming raw material composition (a) containing an isocyanate component and a polyester-based polyol; (B) an isocyanate-terminated prepolymer obtained by reaction of a prepolymer-forming raw material composition (b) containing an isocyanate component and a polyether-based polyol; and a chain extender, wherein the product of curing reaction has a phase-separated structure.
First claim
Opening claim text (preview).
The invention claimed is: 1. A polishing pad having a polishing layer, the polishing layer comprising a product of curing reaction of a polyurethane-forming raw material composition containing: an isocyanate-terminated prepolymer (A) obtained by reaction of a prepolymer-forming raw material composition (a) containing an isocyanate component and a polyester-based polyol; an isocyanate-terminated prepolymer (B) obtained by reaction of a prepolymer-forming raw material composition (b…
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Electricity · mapped topic
Electricity · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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Frequently asked questions
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- What does patent US8939818B2 cover?
- An object of the invention is to provide a polishing pad which has a polishing layer with a phase-separated structure and can provide high polishing rate and high planarization property and with which scratching can be suppressed. The polishing pad comprises the polishing layer. The polishing layer comprises a product of curing reaction of a polyurethane-forming raw material composition contain…
- Who is the assignee on this patent?
- Shimizu Shinji, Kazuno Atsushi, Toyo Tire & Rubber Co
- What technology area does this patent fall under?
- Primary CPC classification B24B37/24. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).