Contact probe and semiconductor element socket provided with same
US-2015369859-A1 · Dec 24, 2015 · US
Test socket having a housing with clamping devices to connect the housing to a floating guide
US8939784B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8939784-B2 |
| Application number | US-201313829081-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 14, 2013 |
| Priority date | Mar 30, 2012 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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Abstract
Official abstract text for this publication.
A semiconductor chip package test socket may include a socket housing; a plurality of probe needles in the socket housing; a conductive pad on the probe needles; a floating guide configured to cover an edge of the conductive pad and configured to provide a semiconductor chip package on the conductive pad; and/or clamps fixed at the socket housing. The clamps may combine the floating guide with the socket housing.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor chip package test socket, comprising: a socket housing; a plurality of probe needles in the socket housing; a conductive pad on the probe needles; a floating guide configured to cover an edge of the conductive pad and configured to provide a semiconductor chip package on the conductive pad; and clamps fixed at the socket housing; wherein the clamps combine the floating guide with the socket housing. 2. The semi…
Assignees
Inventors
Classifications
Electricity · mapped topic
- G01R1/0466Primary
Physics · mapped topic
Physics · mapped topic
- H01R23/70Primary
Electricity · mapped topic
- H01R12/00Primary
Electricity · mapped topic
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- What does patent US8939784B2 cover?
- A semiconductor chip package test socket may include a socket housing; a plurality of probe needles in the socket housing; a conductive pad on the probe needles; a floating guide configured to cover an edge of the conductive pad and configured to provide a semiconductor chip package on the conductive pad; and/or clamps fixed at the socket housing. The clamps may combine the floating guide with …
- Who is the assignee on this patent?
- Samsung Electronics Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification G01R1/0466. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).