Resistor
US-9511587-B2 · Dec 6, 2016 · US
Thermal fluid-ejection echanism having heating resistor on cavity sidewalls
US8939552B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8939552-B2 |
| Application number | US-201113978571-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 31, 2011 |
| Priority date | Jan 31, 2011 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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Abstract
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A thermal fluid-ejection mechanism includes a substrate having a top surface. A cavity formed within the substrate has one or more sidewalls and a floor. The angle of the sidewalls from the floor is greater than or equal to nominally ninety degrees. The thermal fluid-ejection mechanism includes a patterned conductive layer on one or more of the substrate's top surface and the cavity's sidewalls. The thermal fluid-ejection mechanism includes a patterned resistive layer on the sidewalls of the cavity. The patterned resistive layer is located over the patterned conductive layer where the patterned conductive layer is formed on the sidewalls of the cavity. The patterned resistive layer is formed as a heating resistor of the thermal-fluid ejection mechanism. The conductive layer is formed as a conductor of the thermal-fluid ejection mechanism, to permit electrical activation of the heating resistor to cause fluid to be ejected from the thermal fluid-ejection mechanism.
First claim
Opening claim text (preview).
We claim: 1. A method for fabricating a thermal fluid-ejection mechanism, comprising: forming a cavity within a substrate having a top surface, the cavity having one or more sidewalls and a floor, the sidewalls at an angle of greater than or equal to nominally ninety degrees from the floor; forming a patterned conductive layer on one or more of the top surface of the substrate and the sidewalls of the cavity; and, forming a patterned resistive layer on just the sidewalls and n…
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Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
- B41J2/1412Primary
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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- What does patent US8939552B2 cover?
- A thermal fluid-ejection mechanism includes a substrate having a top surface. A cavity formed within the substrate has one or more sidewalls and a floor. The angle of the sidewalls from the floor is greater than or equal to nominally ninety degrees. The thermal fluid-ejection mechanism includes a patterned conductive layer on one or more of the substrate's top surface and the cavity's sidewalls…
- Who is the assignee on this patent?
- Mardilovich Peter, White Lawrence H, Torniainen Erik D, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification B41J2/1412. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).