Electronic device and method of manufacturing the same
US-2024404904-A1 · Dec 5, 2024 · US
Method for manufacturing electronic parts device and resin composition for electronic parts encapsulation
US8938878B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8938878-B2 |
| Application number | US-201113225681-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 6, 2011 |
| Priority date | Sep 6, 2010 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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- Title
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Abstract
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A method for manufacturing an electronic parts device allowing for easy overmolding and underfilling without requiring a jig for preventing leakage of the melted resin composition, and a resin composition sheet for electronic parts encapsulation used therein.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing an electronic parts device, said method comprising: disposing a plurality of electronic parts in an array on a package substrate, and then stacking, in order, a thermosetting resin composition sheet B and a thermosetting resin composition sheet A on an electronic parts-mounting area of the package substrate while arranging the center and XY-plane direction of the electronic parts-mounting area to substantially agree with the center…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8938878B2 cover?
- A method for manufacturing an electronic parts device allowing for easy overmolding and underfilling without requiring a jig for preventing leakage of the melted resin composition, and a resin composition sheet for electronic parts encapsulation used therein.
- Who is the assignee on this patent?
- Toyoda Eiji, Kido Shigetomi, Nitto Denko Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W74/01. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).