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Interlaced focal plane array for wide-area surveillance
US8937639B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8937639-B2 |
| Application number | US-201113249104-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 29, 2011 |
| Priority date | Sep 29, 2010 |
| Publication date | Jan 20, 2015 |
| Grant date | Jan 20, 2015 |
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Abstract
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Systems and methods of acquiring large field of view, high-resolution image data are discussed herein. Techniques and devices relate operation and composition of systems for acquiring large field of view, high-resolution image data. Such systems may include a first sensor chip assembly (SCA) in an interlaced focal plane array (FPA), the first SCA having a length, a width, and a resolution; a second SCA in the FPA, the second SCA having the same length, width, and resolution; and a field of view (FOV) adjustment device that moves the FOV of the FPA so that it can observe different scenes. In some such systems, the first and second SCAs are arranged relative to each-other in a first spaced array extending along a first dimension of the FPA such that there is an intentional gap between the first and second FPAs along the first dimension.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of acquiring large field of view, high-resolution image data, the method comprising: providing a focal plane array (FPA) having a first sensor chip assembly (SCA) and a second SCA arranged in a spaced array on the FPA, where the first and second SCAs are the same size and resolution; and the first and second SCAs are aligned relative to each-other in the FPA in the spaced array with a first intentional gap between the first and second SCAs; firs…
Assignees
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Classifications
- H04N5/2624Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H04N5/33Primary
Electricity · mapped topic
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- What does patent US8937639B2 cover?
- Systems and methods of acquiring large field of view, high-resolution image data are discussed herein. Techniques and devices relate operation and composition of systems for acquiring large field of view, high-resolution image data. Such systems may include a first sensor chip assembly (SCA) in an interlaced focal plane array (FPA), the first SCA having a length, a width, and a resolution; a se…
- Who is the assignee on this patent?
- Kasunic Keith J, Goodnough Mark, Donohue John G, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H04N5/2624. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 20 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).