Method of forming semiconductor devices
US-2024387980-A1 · Nov 21, 2024 · US
US8937576B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8937576-B2 |
| Application number | US-201313782346-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 1, 2013 |
| Priority date | Apr 5, 2011 |
| Publication date | Jan 20, 2015 |
| Grant date | Jan 20, 2015 |
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A wireless communication device includes a flexible base material film, a flexible antenna conductor that is provided in substantially the entire region of one main surface of the flexible base material film and that includes a first radiation element and a second radiation element facing each other through a slit, an inductor substrate that is connected to the first radiation element and the second radiation element so as to extend across the slit, the inductor substrate including an inductance element, and a wireless IC element that is connected in parallel to the inductance element and that is mounted in the inductor substrate. The wireless IC element is connected to the first radiation element and the second radiation element so as to extend across the slit.
Opening claim text (preview).
What is claimed is: 1. A wireless communication device comprising: a flexible base material film; a flexible antenna conductor provided in substantially an entire region of one main surface of the flexible base material film and including a first radiation element and a second radiation element facing each other with a slit therebetween; an inductor substrate connected to the first radiation element and the second radiation element so as to extend across the slit, the inductor…
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