Method for positioning semiconductor devices and corresponding positioning apparatus
US-2024329125-A1 · Oct 3, 2024 · US
US8937484B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8937484-B2 |
| Application number | US-201313916968-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 13, 2013 |
| Priority date | Mar 10, 2009 |
| Publication date | Jan 20, 2015 |
| Grant date | Jan 20, 2015 |
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The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.
Opening claim text (preview).
We claim: 1. A longitudinally compressible unit which forms a plurality of temporary mechanical and electrical connections for use between a device under test having a plurality of terminals and a load board having a plurality of contact pads, each contact pad being laterally arranged to correspond to exactly said terminals, comprising: an electrically insulating top contact plate longitudinally adjacent to the terminals on the device under test; an electrically insulating botto…
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