Semiconductor device and manufacturing method thereof, and transfer sheet and manufacturing method thereof
US-2015357262-A1 · Dec 10, 2015 · US
Electronic component and fabrication process of this electronic component
US8937385B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8937385-B2 |
| Application number | US-201314098712-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 6, 2013 |
| Priority date | Dec 7, 2012 |
| Publication date | Jan 20, 2015 |
| Grant date | Jan 20, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
An electronic component comprising a substrate extending in a plane, having electrical connections to connect the component to a circuit, and having an upper face; an electronic chip arranged on the upper face or inside the substrate and connected to the connections via the substrate, a thick insulating layer forming a package and covering the upper face or at least part of the chip, and having an outer face parallel to the plane; a cavity inside the thick layer, the cavity having a bottom parallel to the plane and a side extending from the bottom to the outer face, the cavity having heat-absorbing material inside that is different from the material forming the thick layer. The heat-absorbing material has a specific heat capacity greater than 1 kJKg −1 K −1 at a 25° C. and at 100 kPa. Either a bottom or side of the cavity is covered with a interface layer.
First claim
Opening claim text (preview).
Having described the invention, and a preferred embodiment thereof, what is claimed as new, and secured by Letters Patent is: 1. A manufacture comprising an electronic component, said electronic component comprising a substrate that extends in substrate plane, said substrate having electrical connections to connect said electronic component to an electronic circuit, said substrate having an upper face, an electronic chip arranged on said upper face of said substrate and/or inside s…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H10W40/735Primary
Electricity · mapped topic
- H05K7/205Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8937385B2 cover?
- An electronic component comprising a substrate extending in a plane, having electrical connections to connect the component to a circuit, and having an upper face; an electronic chip arranged on the upper face or inside the substrate and connected to the connections via the substrate, a thick insulating layer forming a package and covering the upper face or at least part of the chip, and having…
- Who is the assignee on this patent?
- Commissariat Energie Atomique, Commissariat Energie Atomique
- What technology area does this patent fall under?
- Primary CPC classification H10W40/735. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 20 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).