Semiconductor package, method and mold for producing same, input and output terminals of semiconductor package

Patent metadata

Field	Value
Publication number	US-8937374-B2
Application number	US-201214003816-A
Country	US
Kind code	B2
Filing date	Oct 24, 2012
Priority date	Dec 22, 2011
Publication date	Jan 20, 2015
Grant date	Jan 20, 2015

Abstract

A semiconductor package according to the present invention includes: a semiconductor element where a high frequency signal is input or output; a planar lead terminal having an end electrically connected to an input terminal or an output terminal of the semiconductor element; an encapsulation resin for encapsulating the lead terminal and the semiconductor element, the lead terminal having another end exposed from the resin; and a ground enhancing metal body encapsulated in the encapsulation resin, having a first main surface facing the lead terminal and a second main surface exposed from the encapsulation resin, wherein the ground enhancing metal body has a shape with a cross section parallel to the second main surface and having a smaller area than an area of the first main surface.

First claim

The invention claimed is:

1. A semiconductor package comprising:
a semiconductor element where a high frequency signal is input and/or output;
a planar lead for transmitting the high frequency signal to the semiconductor element or an external circuit, the lead having an end electrically connected to an input terminal or an output terminal of the semiconductor element;
a resin for encapsulating the lead and the semiconductor element, the lead having another end exposed from th…

Assignees

• Panasonic Corp

Inventors

• Uno Takashi
• Ikeda Hikaru
• Yahata Kazuhiro
• Iwata Motoyoshi
• Naitou Hiroshi
• Kamiyama Tomohide

Classifications

• H10W90/756

  Electricity · mapped topic

• H10W90/736

  Electricity · mapped topic

• H10W74/111

  Electricity · mapped topic

• H10W74/016

  Electricity · mapped topic

• H10W72/5445

  Electricity · mapped topic