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Semiconductor device having a reinforcing member for filling a gap between a semiconductor chip and a cover member and manufacturing method for semiconductor device
US8937362B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8937362-B2 |
| Application number | US-201313975578-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 26, 2013 |
| Priority date | Mar 1, 2011 |
| Publication date | Jan 20, 2015 |
| Grant date | Jan 20, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An image pickup apparatus includes a semiconductor chip including a light receiving section, a frame-like spacer arranged on the semiconductor chip to surround the light receiving section, a transparent flat plate section arranged on the semiconductor chip via the spacer and having a plan view dimension larger than a plan view dimension of the spacer and smaller than a plan view dimension of the semiconductor chip, and a reinforcing member for filling a gap between the semiconductor chip and the transparent flat plate section on the outer side of the spacer and having a plan view dimension larger than the plan view dimension of the transparent flat plate section and smaller than the plan view dimension of the semiconductor chip.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: an image pickup device chip including a light receiving element section; a frame-like spacer arranged on the image pickup device chip to surround the light receiving element section; a cover member formed of a transparent flat plate, arranged on the image pickup device chip via the spacer and having a plan view dimension larger than a plan view dimension of the spacer and smaller than a plan view dimension of the image…
Assignees
Inventors
Classifications
- H10W76/40Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10F77/50Primary
Electricity · mapped topic
- H01L31/0203Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8937362B2 cover?
- An image pickup apparatus includes a semiconductor chip including a light receiving section, a frame-like spacer arranged on the semiconductor chip to surround the light receiving section, a transparent flat plate section arranged on the semiconductor chip via the spacer and having a plan view dimension larger than a plan view dimension of the spacer and smaller than a plan view dimension of th…
- Who is the assignee on this patent?
- Olympus Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W76/40. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 20 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).