III-V photonic integration on silicon

Patent metadata

Field	Value
Publication number	US-8937296-B2
Application number	US-201213359822-A
Country	US
Kind code	B2
Filing date	Jan 27, 2012
Priority date	Jan 20, 2006
Publication date	Jan 20, 2015
Grant date	Jan 20, 2015

Abstract

Photonic integrated circuits on silicon are disclosed. By bonding a wafer of III-V material as an active region to silicon and removing the substrate, the lasers, amplifiers, modulators, and other devices can be processed using standard photolithographic techniques on the silicon substrate. The coupling between the silicon waveguide and the III-V gain region allows for integration of low threshold lasers, tunable lasers, and other photonic integrated circuits with Complimentary Metal Oxide Semiconductor (CMOS) integrated circuits.

First claim

What is claimed is:

1. An article comprising:
(1) a semiconductor-on-insulator substrate, the semiconductor-on-insulator substrate comprising:
(a) a single-crystal silicon substrate;
(b) a first dielectric layer that is disposed on and in direct contact with the single-crystal silicon substrate, the first dielectric layer comprising a first dielectric material;
(c) a first semiconductor layer that is disposed on and in direct contact with the first dielectric layer, the first semiconductor layer having a first surface, and the first semiconductor layer including a first waveguide;

(2) a semiconductor structure comprising;
(a) a first compound semiconductor layer having at least one quantum-well layer, the semiconductor structure being bonded to the first semiconductor layer at a bonded interface located at the first surface, the bonded interface being characterized by a lattice mismatch, wherein the semiconductor structure and the first waveguide collectively define at least a portion of an optical cavity; and
(b) a grating, the grating being operable for reflecting light propagating within the first waveguide; and

(3) a distributed-Bragg-reflector pair that defines a dimension of the optical cavity within the first waveguide;
wherein the at least one quantum-well layer and the first waveguide are optically coupled in an evanescent manner.

2. The article of claim 1 further comprising ( 3 ) an electrical device, the electrical device being at least partially formed in the first semiconductor layer.

3. The article of claim 1 further comprising ( 3 ) an electrical device, the electrical device being at least partially formed in the first compound semiconductor structure.

4. The article of claim 1 wherein the first dielectric layer comprises silicon dioxide.

5. The article of claim 4 wherein the first semiconductor layer comprises single-crystal silicon.

6. The article of claim 1 wherein the first waveguide includes the grating.

7. An article comprising:
(1) a silicon-on-insulator substrate, the silicon-on-insulator substrate comprising a first silicon layer having a first surface and a first waveguide, the first silicon layer being disposed on and in direct contact with a silicon dioxide layer that is disposed on and in direct contact with a single-crystal silicon wafer;
(2) a semiconductor structure including a first compound semiconductor layer having at least one quantum-well layer, the semiconductor structure being bonded to the first silicon layer at a bonded interface located at the first surface, the bonded interface being characterized by a lattice mismatch; and
(3) a grating pair, the grating pair being optically coupled with the first waveguide, wherein the grating pair, the semiconductor structure, and the first waveguide collectively define a laser having an optical cavity;
wherein the at least one quantum-well layer and the first waveguide are optically coupled in an evanescent manner.

8. The article of claim 7 wherein the laser is an evanescent laser having an optical mode that is at least partially resident in each of the first compound semiconductor layer and the first waveguide.

9. The article of claim 7 wherein the semiconductor structure and the first waveguide collectively define an optical modulator.

10. The article of claim 7 further comprising (3) an electrical circuit including at least one transistor that is at least partially formed in the first silicon layer.

Assignees

• Bowers John Edward
• Univ California

Inventors

• Bowers John Edward

Classifications

• H10F55/18

  wherein the radiation-sensitive semiconductor devices and the electric light source share a common body having dual-functionality of light emission and light detection · CPC title

• H10F39/12

  Image sensors · CPC title

• H10F71/1276

  comprising growth substrates not made of Group III-V materials · CPC title

• H01S5/0268

  Integrated waveguide grating router, e.g. emission of a multi-wavelength laser array is combined by a "dragon router" · CPC title

• H01S5/0217

  Removal of the substrate · CPC title