Information encoding using wirebonds

Patent metadata

Field	Value
Publication number	US-8937010-B2
Application number	US-201313779036-A
Country	US
Kind code	B2
Filing date	Feb 27, 2013
Priority date	Feb 27, 2013
Publication date	Jan 20, 2015
Grant date	Jan 20, 2015

Abstract

A method and structure for encoding information on an integrated circuit chip. The method includes selecting a set of chip pads of the integrated circuit chip for encoding the information; encoding the information during a wirebonding process, the wirebonding process comprising forming ball bonds on chip pads of the integrated circuit chip and wedge bonds on leadframe fingers adjacent to one or more edges of the integrated circuit chip, the ball bonds and the wedge bonds connected by respective and integral wires; and wherein the information is encoded by varying one or more wirebonding parameters on each chip pad of the set of chip pads, the wirebonding parameters selected from the group consisting of the location of a ball bond, the diameter of a ball bond, both the location and diameter of a ball bond, the location of a wedge bond and combinations thereof.

First claim

What is claimed is:

1. A method of encoding information on an integrated circuit chip, comprising:
selecting a set of chip pads of said integrated circuit chip for encoding said information;
encoding said information during a wirebonding process, said wirebonding process comprising forming ball bonds on chip pads of said integrated circuit chip and wedge bonds on leadframe fingers adjacent to one or more edges of said integrated circuit chip, said ball bonds and said wedge bonds…

Assignees

• IBM

Inventors

• Bentley Jr William E
• Bowe Nathanial W
• Brignull Alfred J
• Dirocco Mark A
• Rudick Thomas C

Classifications

• H10W90/756

  Electricity · mapped topic

• H10W74/00

  Electricity · mapped topic

• H10W72/9445

  Electricity · mapped topic

• H10W72/07554

  Electricity · mapped topic

• H10W72/07552

  Electricity · mapped topic