Underlayer composition and method of manufacturing a semiconductor device
US-2024369932-A1 · Nov 7, 2024 · US
US8936899B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8936899-B2 |
| Application number | US-201213602367-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 4, 2012 |
| Priority date | Sep 4, 2012 |
| Publication date | Jan 20, 2015 |
| Grant date | Jan 20, 2015 |
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A thermally-sensitive, positive-working lithographic printing plate precursor can be used to prepare lithographic printing plates using high pH, silicate-free processing solutions. The precursor has a grained an anodized aluminum-containing substrate including a poly(vinyl phosphonic acid) interlayer. A first ink receptive layer, and optionally a second ink receptive layer, is disposed directly on the poly(vinyl phosphonic acid) interlayer. This first ink receptive layer comprises an aromatic acid dye that comprises at least two aromatic groups in an amount of least 0.5 weight %. In addition, the precursor comprises an infrared radiation absorber in one of the layers.
Opening claim text (preview).
The invention claimed is: 1. A positive-working, infrared radiation-sensitive lithographic printing plate precursor that comprises: a grained and anodized aluminum-containing substrate, a poly(vinyl phosphonic acid) interlayer disposed directly on the grained and anodized aluminum substrate, a first ink receptive layer that is disposed directly on the poly(vinyl phosphonic acid) interlayer, the first ink receptive layer comprising at least one water-insoluble, alkali solution-…
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