Acrylic Polymer Formulations
US-2016310433-A1 · Oct 27, 2016 · US
Integratable assisted cooling system for precision extrusion deposition in the fabrication of 3D scaffolds
US8936742B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8936742-B2 |
| Application number | US-201113243226-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 23, 2011 |
| Priority date | Sep 28, 2010 |
| Publication date | Jan 20, 2015 |
| Grant date | Jan 20, 2015 |
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- Title
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Abstract
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The present invention relates to an integrated Assisting Cooling (AC) device, system and method for use with PED devices, allowing use of biopolymers having higher melting points in the fabrication of 3D scaffolds. The AC device cools the filament as it is extruding from the nozzle via low flow convective cooling. The AC device allows for cooling in the +/− direction of motion on an XY plane. The AC device elevates with the material delivery chamber. The AC device allows for scaffold fabrication at applied temperatures as high as about 250° C.
First claim
Opening claim text (preview).
We claim: 1. A device for cooling a polymer filament extruded from a polymer extruder of a precision extrusion deposition system, comprising: a flow line comprising a continuous loop having a hollow interior, at least one inlet providing access to the hollow interior of the continuous loop, and a plurality of outlets also accessing the hollow interior of the continuous loop; a mounting structure for attaching the device to the polymer extruder, the mounting structure dimensioned…
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Operations & Transport · mapped topic
Operations & Transport · mapped topic
- B29C48/911Primary
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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- What does patent US8936742B2 cover?
- The present invention relates to an integrated Assisting Cooling (AC) device, system and method for use with PED devices, allowing use of biopolymers having higher melting points in the fabrication of 3D scaffolds. The AC device cools the filament as it is extruding from the nozzle via low flow convective cooling. The AC device allows for cooling in the +/− direction of motion on an XY plane. T…
- Who is the assignee on this patent?
- Sun Wei, Hamid Qudus, Univ Drexel
- What technology area does this patent fall under?
- Primary CPC classification B29C48/911. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jan 20 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).