Devices, Systems and Methods for Coating Surfaces
US-2015322583-A1 · Nov 12, 2015 · US
Electrochemical deposition apparatus
US8936705B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8936705-B2 |
| Application number | US-201213684902-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 26, 2012 |
| Priority date | Jun 21, 2002 |
| Publication date | Jan 20, 2015 |
| Grant date | Jan 20, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
First claim
Opening claim text (preview).
The invention claimed is: 1. An apparatus for forming a metal film onto a substrate, comprising: a substrate holder configured to hold the substrate such that the metal film is formed on a front surface of the substrate; and electrical contacts each having a contact end for elastically contacting a circumferential surface of the substrate while the contact end of each of the electrical contacts is pressing the circumferential surface of the substrate inwardly to supply electric…
Assignees
Inventors
Classifications
Chemistry & Metallurgy · mapped topic
- C25D17/06Primary
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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Frequently asked questions
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- What does patent US8936705B2 cover?
- The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a …
- Who is the assignee on this patent?
- Ebara Corp
- What technology area does this patent fall under?
- Primary CPC classification C25D17/06. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jan 20 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).