Piezoelectric actuator and liquid discharging head
US-2024334834-A1 · Oct 3, 2024 · US
Liquid ejecting head and liquid ejecting apparatus
US8936355B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8936355-B2 |
| Application number | US-201314141159-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 26, 2013 |
| Priority date | Dec 27, 2012 |
| Publication date | Jan 20, 2015 |
| Grant date | Jan 20, 2015 |
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- Title
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Abstract
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A liquid ejecting head suppresses erosion of silicon substrates by liquid, and whereby suppresses leakage of liquid, discharging failure of liquid droplets, and peeling-off of laminated substrates. The liquid ejecting head includes at least a nozzle plate on which nozzle openings for discharging liquid are provided, and a flow path formation substrate on which a pressure generation chamber communicating with the nozzle openings is provided. The nozzle plate is formed with a silicon substrate. At least the flow path formation substrate and the nozzle plate are bonded to each other after providing a tantalum oxide film formed by atomic layer deposition on the entire surfaces including a bonded surface.
First claim
Opening claim text (preview).
What is claimed is: 1. A liquid ejecting head at least comprising: a nozzle plate on which nozzle openings for discharging liquid are provided; and a flow path formation substrate on which a pressure generation chamber communicating with the nozzle openings is provided, wherein the nozzle plate is formed with a silicon substrate, and at least the flow path formation substrate and the nozzle plate are bonded to each other after providing a tantalum oxide film formed by atomic…
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Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US8936355B2 cover?
- A liquid ejecting head suppresses erosion of silicon substrates by liquid, and whereby suppresses leakage of liquid, discharging failure of liquid droplets, and peeling-off of laminated substrates. The liquid ejecting head includes at least a nozzle plate on which nozzle openings for discharging liquid are provided, and a flow path formation substrate on which a pressure generation chamber comm…
- Who is the assignee on this patent?
- Seiko Epson Corp
- What technology area does this patent fall under?
- Primary CPC classification B41J2/14233. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jan 20 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).