Thermal distribution systems and methods

US8936072B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8936072-B2
Application numberUS-81411410-A
CountryUS
Kind codeB2
Filing dateJun 11, 2010
Priority dateJun 11, 2010
Publication dateJan 20, 2015
Grant dateJan 20, 2015

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Thermal distribution systems and methods are provided. A thermal distribution system can include a first surface having a perimeter and a second surface. At least a portion of the perimeter can be disposed proximate the second surface, forming a void between the first and second surfaces. The first surface can include a plurality of perforations. The second surface can include at least a portion of an electronic enclosure. A fluid mover having a first inlet can be adapted to draw a first inlet fluid from inside the void.

First claim

Opening claim text (preview).

We claim the following: 1. A thermal distribution system, comprising: a first surface having a plurality of perforations and a fluid inlet opening formed therein; a second surface spaced from the first surface to form a void therebetween, the second surface comprising at least a portion of an electronic enclosure; a perimeter surface extended from at least a portion of a perimeter of the first surface to the second surface; and a fluid mover disposed proximate the fluid inle…

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Next steps

Free tools are coming soon. Tell us what you want to track and we'll notify you.

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US8936072B2 cover?
Thermal distribution systems and methods are provided. A thermal distribution system can include a first surface having a perimeter and a second surface. At least a portion of the perimeter can be disposed proximate the second surface, forming a void between the first and second surfaces. The first surface can include a plurality of perforations. The second surface can include at least a portio…
Who is the assignee on this patent?
Senatori Mark David, Hewlett Packard Development Co
What technology area does this patent fall under?
Primary CPC classification G06F1/203. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 20 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).