Selective cuts to remove predicted interconnect bulging regions
US-2024419882-A1 · Dec 19, 2024 · US
US8935644B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8935644-B2 |
| Application number | US-201214234550-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 27, 2012 |
| Priority date | Jul 29, 2011 |
| Publication date | Jan 13, 2015 |
| Grant date | Jan 13, 2015 |
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A printed substrate design system includes: an EMI condition determination unit that compares an EMI characteristic derived by an EMI characteristic derivation unit with an EMI allowable condition, and determines whether the EMI characteristic of a printed substrate satisfies the EMI allowable condition; a substrate configuration change unit that changes an internal configuration of the printed substrate to obtain a changed configuration of the printed substrate in a case where the EMI condition determination unit has determined that the EMI allowable condition is not satisfied, and sets design information of the changed configuration of the printed substrate to design information for deriving the EMI characteristic in the EMI characteristic derivation unit; and an output unit that outputs a printed substrate configuration in a case where the EMI condition determination unit has determined the EMI allowable condition is satisfied.
Opening claim text (preview).
The invention claimed is: 1. A printed substrate design system for designing a substrate configuration of a printed substrate so as to suppress common mode radiation occurring from a cable connected to the printed substrate, an IC and a passive component being mounted on the printed substrate, the printed substrate design system comprising: an input unit that receives input of printed substrate design information; an EMI characteristic derivation unit that derives an EMI charact…
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