Circuit Board Wafer with Contacts Mounted on Castellated Edges
US-2024145960-A1 · May 2, 2024 · US
Protective cover for pressure sensor assemblies
US8934263B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8934263-B2 |
| Application number | US-201113195806-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 1, 2011 |
| Priority date | Aug 1, 2011 |
| Publication date | Jan 13, 2015 |
| Grant date | Jan 13, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cover for use with a sensor assembly may include an electrically insulating body having perimeter features extending a majority of the way around perimeters of upper and lower printed circuit boards that the cover may vertically separate. In one example, the body of the cover may include support features that extend from a lower side of the cover and those support features may contact the lower printed circuit board in at least two locations. The support features of the cover may be separated by a gap and a sensor connected to the lower printed circuit board may be situated within the gap.
First claim
Opening claim text (preview).
What is claimed is: 1. A cover for a sensor sub-assembly, wherein the sensor sub-assembly includes a first printed circuit board that carries a sensor, the cover comprising: an electrically insulating body; the electrically insulating body including a first support feature that extends across at least a majority of the first printed circuit board, a second support feature that extends across at least a majority of the first printed circuit board, and a perimeter support feature…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H01R12/585Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8934263B2 cover?
- The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cover for use with a sensor assembly may include an electrically insulating body having perimeter features extending a majority of the way around perimeters of upper and lower printed circuit boards that the cover may vertically separate. In one example, the body of the co…
- Who is the assignee on this patent?
- Eckhardt Todd, Machir Jim, Thanigachalam Palani, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H01R12/585. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).