Electrical contact for implantable medical device
US-2015375002-A1 · Dec 31, 2015 · US
Compact device housing and assembly techniques therefor
US8934261B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8934261-B2 |
| Application number | US-48942909-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 23, 2009 |
| Priority date | Dec 23, 2008 |
| Publication date | Jan 13, 2015 |
| Grant date | Jan 13, 2015 |
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Abstract
Official abstract text for this publication.
High density electronic device assemblies and techniques for forming high density electronic device assemblies are disclosed. These assemblies and techniques can be used to form compact electronic devices. In one embodiment, substrate arrangements that include a multiple-part substrate can be used to form a high density electronic device assembly. In another embodiment, one or more clips can be used in a high density electronic device assembly to provide mechanical and electrical interconnection between electrical structures that are to be removably coupled together as parts of the high density electronic device assembly. In still another embodiment, a removable cap (and a method for forming the removable cap) can be used for an electronic device housing.
First claim
Opening claim text (preview).
What is claimed is: 1. An electronic device, comprising: a housing having at least one opening; an electrical connector accessible from the opening in said housing, wherein the electrical connector has a plurality of sides; and a printed circuit board assembly comprising a plurality of printed circuit boards having a plurality of electrical components coupled thereto, said printed circuit board assembly being provided within said housing and being electrically connected to sai…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US8934261B2 cover?
- High density electronic device assemblies and techniques for forming high density electronic device assemblies are disclosed. These assemblies and techniques can be used to form compact electronic devices. In one embodiment, substrate arrangements that include a multiple-part substrate can be used to form a high density electronic device assembly. In another embodiment, one or more clips can be…
- Who is the assignee on this patent?
- Lin Wey-Jiun, Pan Kevin, De La Cruz Conrado Sacluti, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H01R13/111. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).