Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
Electronic device with heat dissipation assembly
US8934249B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8934249-B2 |
| Application number | US-201213610891-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 12, 2012 |
| Priority date | Aug 30, 2012 |
| Publication date | Jan 13, 2015 |
| Grant date | Jan 13, 2015 |
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- Title
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Abstract
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An electronic device includes a sidewall, a circuit board arranged on the sidewall, an electronic component set on a side of the circuit board opposite to the sidewall, and a heat dissipation assembly connected between the sidewall and the circuit board.
First claim
Opening claim text (preview).
What is claimed is: 1. An electronic device, comprising: a sidewall; a circuit board mounted on the sidewall and spaced from the sidewall, the circuit board comprising: traces; and two elongated heat conduction bars embedded in and exposed through a bottom of the circuit board; an electronic component set on a side of the circuit board opposite to the sidewall, two elongated heat conduction bars are respectively located at opposite sides of the electronic component and ar…
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Classifications
Electricity · mapped topic
- H10W40/10Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8934249B2 cover?
- An electronic device includes a sidewall, a circuit board arranged on the sidewall, an electronic component set on a side of the circuit board opposite to the sidewall, and a heat dissipation assembly connected between the sidewall and the circuit board.
- Who is the assignee on this patent?
- Chen Tsung-Ming, Chang Yao-Ting, Hon Hai Prec Ind Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W40/10. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).