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Measuring device and a method for measuring a chip-to-chip-carrier connection
US8933722B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8933722-B2 |
| Application number | US-201113222121-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 31, 2011 |
| Priority date | Aug 31, 2011 |
| Publication date | Jan 13, 2015 |
| Grant date | Jan 13, 2015 |
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Abstract
Official abstract text for this publication.
A measuring device is provided, the measuring device including: a power supply to provide electric power to a chip via at least one of a chip connection and a chip-carrier connection; a chip arrangement receiving portion configured to receive a chip arrangement, the chip arrangement including a chip and a plurality of chip-to-chip-carrier connections; a detection portion including: a plate; a detection circuit coupled to the plate and configured to detect an electrical signal from the plate; wherein the plate is configured such that it covers at least part of the chip arrangement; and wherein at least one chip-carrier connection is in electrical connection with the plate.
First claim
Opening claim text (preview).
What is claimed is: 1. A measuring device, comprising: a power supply configured to provide electric power to a chip via at least one of a chip connection and a chip-carrier connection; a chip arrangement receiving portion configured to receive a chip arrangement, the chip arrangement comprising a chip and a plurality of chip-to-chip-carrier connections; a detection portion comprising: a plate; a detection circuit coupled to the plate and configured to detect an electrical…
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- G01R31/312Primary
Physics · mapped topic
Physics · mapped topic
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Frequently asked questions
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- What does patent US8933722B2 cover?
- A measuring device is provided, the measuring device including: a power supply to provide electric power to a chip via at least one of a chip connection and a chip-carrier connection; a chip arrangement receiving portion configured to receive a chip arrangement, the chip arrangement including a chip and a plurality of chip-to-chip-carrier connections; a detection portion including: a plate; a d…
- Who is the assignee on this patent?
- Xue Ming, Infineon Technologies Ag
- What technology area does this patent fall under?
- Primary CPC classification G01R31/312. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Jan 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).