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Semiconductor device and method for manufacturing semiconductor device
US8933554B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8933554-B2 |
| Application number | US-201213978323-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 11, 2012 |
| Priority date | Jul 28, 2011 |
| Publication date | Jan 13, 2015 |
| Grant date | Jan 13, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A semiconductor device has an insulation substrate formed with a conductive pattern; an independent terminal, which is an externally leading terminal, soldered to the conductive pattern of the insulation substrate; a case disposed over the insulation substrate such that a top surface of the independent terminal is exposed; an opening provided on a side surface of the case; a nut glove inserted from the opening so as to be below the independent terminal, and fix the independent terminal; and a first projection part formed on a side surface of the nut glove, and having tapers in a frontward direction and a rearward direction of insertion of the nut glove, respectively. The rearward taper of the first projection part is pressure contacting with a sidewall surface of the opening.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor device, comprising: an insulation substrate formed with a conductive pattern; an independent terminal, which is an externally leading terminal, soldered to the conductive pattern of the insulation substrate; a case disposed over the insulation substrate such that a top surface of the independent terminal is exposed; an opening provided on a side surface of the case; a nut glove, being inserted from the opening so as to be below the in…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10W40/10Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8933554B2 cover?
- A semiconductor device has an insulation substrate formed with a conductive pattern; an independent terminal, which is an externally leading terminal, soldered to the conductive pattern of the insulation substrate; a case disposed over the insulation substrate such that a top surface of the independent terminal is exposed; an opening provided on a side surface of the case; a nut glove inserted …
- Who is the assignee on this patent?
- Kodaira Yoshihiro, Fuji Electric Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W40/10. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).