Integrated circuit stack with integrated electromagnetic interference shielding

Patent metadata

Field	Value
Publication number	US-8933544-B2
Application number	US-201213547997-A
Country	US
Kind code	B2
Filing date	Jul 12, 2012
Priority date	Jul 12, 2012
Publication date	Jan 13, 2015
Grant date	Jan 13, 2015

Abstract

An integrated circuit system includes a first device wafer having a first semiconductor layer proximate to a first metal layer including a first conductor disposed within a first metal layer oxide. A second device wafer having a second semiconductor layer proximate to a second metal layer including a second conductor is disposed within a second metal layer oxide. A frontside of the first device wafer is bonded to a frontside of the second device wafer at a bonding interface. A conductive path couples the first conductor to the second conductor through the bonding interface. A first metal EMI shield is disposed in one of the first metal oxide layer and second metal layer oxide layer. The first EMI shield is included in a metal layer of said one of the first metal oxide layer and the second metal layer oxide layer nearest to the bonding interface.

First claim

What is claimed is:

1. An integrated circuit system, comprising:
a first device wafer having a first semiconductor layer proximate to a first metal layer including a first conductor disposed within a first metal layer oxide;
a second device wafer having a second semiconductor layer proximate to a second metal layer including a second conductor disposed within a second metal layer oxide, wherein a frontside of the first metal layer oxide of the first device wafer is bonded to a frontside of the second metal layer oxide of the second device wafer at a bonding interface between the first metal layer oxide and the second metal layer oxide, wherein one of the first device wafer and second device wafer comprises an imager chip and an other one of the first device wafer and second device wafer comprises a processing chip;
a conductive path coupling the first conductor to the second conductor, wherein the conductive path is formed in a cavity etched between the first conductor and the second conductor and etched through the bonding interface and through the second semiconductor layer from a backside of the second device wafer; and
a first metal electromagnetic interference (EMI) shield disposed in one of the first metal layer oxide and second metal layer oxide, wherein the first EMI shield is included in a metal layer of said one of the first metal layer oxide and the second metal layer oxide nearest to the bonding interface.

2. The integrated circuit system of claim 1 wherein the bonding interface comprises an oxide-to-oxide bonding interface between the first metal layer oxide and the second metal layer oxide.

3. The integrated circuit system of claim 1 wherein the bonding interface comprises an oxide-to-metal bonding interface between the first EMI shield and an other one of said one of the first metal layer oxide and second metal layer oxide.

4. The integrated circuit system of claim 1 further comprising a second metal EMI shield disposed in an other one of the first metal layer oxide and second metal layer oxide, wherein the second EMI shield is included in a metal layer of said other one of the first metal layer oxide and second metal layer oxide nearest to the bonding interface.

5. The integrated circuit system of claim 4 wherein the bonding interface includes a metal-to-metal bonding interface between the first metal EMI shield and the second metal EMI shield.

6. The integrated circuit system of claim 1 wherein the first metal EMI shield comprises a solid metal piece.

7. The integrated circuit system of claim 1 wherein the first metal EMI shield comprises a metal grid.

8. The integrated circuit system of claim 7 wherein openings in the metal grid are substantially smaller than a wavelength of electromagnetic interference to be generated within the integrated circuit system.

9. The integrated circuit system of claim 1 wherein the conductive path is formed through a hole defined in the second conductor.

10. The integrated circuit system of claim 1 wherein the first EMI shield is coupled to the first conductor.

11. An integrated circuit system, comprising:
a first device wafer having a first semiconductor layer proximate to a first metal layer including a first conductor disposed within a first metal layer oxide;
a second device wafer having a second semiconductor layer proximate to a second metal layer including a second conductor disposed within a second metal layer oxide, wherein one of the first device wafer and second device wafer comprises an imager chip and an other one of the first device wafer and second device wafer comprises a processing chip;
a first metal electromagnetic interference (EMI) shield disposed in the first metal layer oxide, wherein the first EMI shield is located at a frontside of the first metal layer oxide of the first device wafer; and
a second metal EMI shield disposed in the second metal layer oxide, wherein the second EMI shield is located at a frontside of the second metal layer oxide of the second device wafer, wherein the frontside of the first metal layer oxide of the first device wafer is bonded to the frontside of the second metal layer oxide of the second device wafer at a bonding interface such that the first EMI shield is bonded to the second EMI shield with a metal-to-metal bonding interface.

12. The integrated circuit system of claim 11 wherein further comprising a conductive path coupling the first conductor to the second conductor, wherein the conductive path is formed in a cavity etched between the first conductor and the second conductor and etched through the bonding interface and through the second semiconductor layer from a backside of the second device wafer.

13. The integrated circuit system of claim 11 wherein the first conductor is located at the frontside of the first metal layer oxide of the first device wafer and wherein the second conductor is located at the frontside of the second metal layer oxide of the second device wafer, wherein the first conductor is bonded to the second conductor with the metal-to-metal bonding interface.

14. The integrated circuit system of claim 11 wherein the first and second metal EMI shields comprise solid metal pieces.

15. The integrated circuit system of claim 11 wherein the first and second metal EMI shields comprise metal grids.

16. The integrated circuit system of claim 15 wherein openings in the first and second metal grids are substantially smaller than a wavelength of electromagnetic interference to be generated within the integrated circuit system.

17. An imaging system, comprising:
a pixel array having a plurality of image sensor pixels, wherein the pixel array is included in an integrated circuit system including:
a first device wafer having a first semiconductor layer proximate to a first metal layer including a first conductor disposed within a first metal layer oxide;
a second device wafer having a second semiconductor layer proximate to a second metal layer including a second conductor disposed within a second metal layer oxide, wherein a frontside of the first metal layer oxide of the first device wafer is bonded to a frontside of the second metal layer oxide of the second device wafer at a bonding interface between the first metal layer oxide and the second metal layer oxide, wherein one of the first device wafer and second device wafer comprises an imager chip and an other one of the first device wafer and second device wafer comprises a processing chip;
a conductive path coupling the first conductor to the second conductor, wherein the conductive path is formed in a cavity etched between the first conductor and the second conductor and etched through the bonding interface and through the second semiconductor layer from a backside of the second device wafer; and
a first metal electromagnetic interference (EMI) shield disposed in one of the first metal layer oxide and second metal layer oxide, wherein the first EMI shield is included in a metal layer of said one of the first metal layer oxide and the second metal layer oxide nearest to the bonding interface;

control circuitry coupled to the pixel array to control operation of the pixel array; and
readout circuitry coupled to the pixel array to readout image data from the plurality of image sensor pixels.

18. The imaging system of claim 17 further comprising function logic coupled to the readout circuitry to store the image data readout from the plurality of image sensor pixels.

19. The imaging system of claim 17 wherein the bonding interface comprises an oxide-to-oxi

Assignees

• Mao Duli
• Tai Hsin-Chih
• Qian Yin
• Dai Tiejun
• Rhodes Howard E
• Yang Hongli
• Omnivision Tech Inc

Inventors

• Mao Duli
• Tai Hsin-Chih
• Qian Yin
• Dai Tiejun
• Rhodes Howard E
• Yang Hongli

Classifications

• H10F39/018

  of hybrid image sensors · CPC title

• H10F39/809

  of hybrid image sensors · CPC title

• H10F39/199

  Back-illuminated image sensors · CPC title

• H10F39/8057 Primary

  Optical shielding · CPC title