Semiconductor device including buried contact and method for manufacturing the same
US-12178034-B2 · Dec 24, 2024 · US
US8933508B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8933508-B2 |
| Application number | US-201313799084-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 13, 2013 |
| Priority date | Jun 24, 2005 |
| Publication date | Jan 13, 2015 |
| Grant date | Jan 13, 2015 |
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A recessed transistor construction is formed between a first access transistor construction and a second access transistor construction to provide isolation between the access transistor constructions of a memory device. In some embodiments, a gate of the recessed transistor construction is grounded. In an embodiment, the access transistor constructions are recess access transistors. In an embodiment, the memory device is a DRAM. In another embodiment, the memory device is a 4.5F2 DRAM cell.
Opening claim text (preview).
What is claimed is: 1. An apparatus comprising: a substrate having a doping concentration; a memory cell comprising a charge storage device and a recessed access device, wherein the recessed access device extends into the substrate and is configured to induce a first depletion region in the substrate; and an isolation structure configured to isolate the memory cell from an adjacent memory cell, wherein the apparatus is configured such that during operation the isolation struct…
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