Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
US8933484B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8933484-B2 |
| Application number | US-201313906930-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 31, 2013 |
| Priority date | Jun 4, 2012 |
| Publication date | Jan 13, 2015 |
| Grant date | Jan 13, 2015 |
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A heat transfer member is disposed between a semiconductor element and an electrode plate. The heat transfer member comprises a metal portion extending between a first face at the semiconductor element side and a second face at the plate electrode side, and a ceramic portion surrounding the metal portion. An area of the first face is less than an area of the second face in the metal portion.
Opening claim text (preview).
What is claimed is: 1. A heat transfer member to be disposed between a semiconductor element and an electrode plate, the heat transfer member comprising: a metal portion extending between a first face on a semiconductor element side and a second face on a plate electrode side; and a ceramic portion surrounding the metal portion, wherein an area of the first face is less than an area of the second face in the metal portion. 2. The heat transfer member acco…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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