Lead frame assembly, LED package and LED light bar

US8933481B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8933481-B2
Application numberUS-201313850375-A
CountryUS
Kind codeB2
Filing dateMar 26, 2013
Priority dateApr 11, 2012
Publication dateJan 13, 2015
Grant dateJan 13, 2015

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A lead frame assembly includes a surrounding frame and a plurality of lead frame sets arranged in a matrix. Each lead frame set includes spaced-apart first and second lead frames and a connecting structure interconnecting one of the lead frame sets to an adjacent lead frame set. Each lead frame set is further connected to the surrounding frame through the connecting structure thereof. A plurality of insulated bars are spacedly formed on a lead frame panel. Each insulated bar covers a corresponding row of the lead frame sets and exposes bottom surfaces of the first and second lead frames. Each insulated bar further covers portions of the surrounding frame that are adjacent to two opposite outermost ones of the lead frame sets.

First claim

Opening claim text (preview).

What is claimed is: 1. A light emitting diode package, comprising: a lead frame set including a first lead frame, a second lead frame, at least two first connecting pieces, and at least two second connecting pieces, said first and second lead frames being spaced apart along a straight line, said two first connecting pieces extending outward from two opposite sides of said first lead frame transversely relative to said straight line, said two second connecting pieces extending outw…

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What does patent US8933481B2 cover?
A lead frame assembly includes a surrounding frame and a plurality of lead frame sets arranged in a matrix. Each lead frame set includes spaced-apart first and second lead frames and a connecting structure interconnecting one of the lead frame sets to an adjacent lead frame set. Each lead frame set is further connected to the surrounding frame through the connecting structure thereof. A plurali…
Who is the assignee on this patent?
Lite On Electronics Guangzhou, Lite On Technology Corp
What technology area does this patent fall under?
Primary CPC classification H10H20/857. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).