Apparatus having a dielectric containing scandium and gadolinium

US8933449B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8933449-B2
Application numberUS-201314099107-A
CountryUS
Kind codeB2
Filing dateDec 6, 2013
Priority dateAug 30, 2005
Publication dateJan 13, 2015
Grant dateJan 13, 2015

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Abstract

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Apparatus having a dielectric containing scandium and gadolinium can provide a reliable structure with a high dielectric constant (high k). In an embodiment, a monolayer or partial monolayer sequence process, such as for example atomic layer deposition (ALD), can be used to form a dielectric containing gadolinium oxide and scandium oxide. In an embodiment, a dielectric structure can be formed by depositing gadolinium oxide by atomic layer deposition onto a substrate surface using precursor chemicals, followed by depositing scandium oxide onto the substrate using precursor chemicals, and repeating to form a thin laminate structure. A dielectric containing scandium and gadolinium may be used as gate insulator of a MOSFET, a capacitor dielectric in a DRAM, as tunnel gate insulators in flash memories, as a NROM dielectric, or as a dielectric in other electronic devices, because the high dielectric constant (high k) of the film provides the functionality of a much thinner silicon dioxide film.

First claim

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What is claimed is: 1. A memory device comprising: a substrate comprising a plurality of diffusions; a dielectric layer formed on the substrate between the plurality of diffusions, the dielectric layer comprising Gd X Sc Y O 3 formed as interleaved layers of scandium oxide and gadolinium oxide wherein a ratio of thicknesses of the interleaved layers is not equal; and a gate electrode formed on the dielectric layer. 2. The memory device of claim 1 where…

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What does patent US8933449B2 cover?
Apparatus having a dielectric containing scandium and gadolinium can provide a reliable structure with a high dielectric constant (high k). In an embodiment, a monolayer or partial monolayer sequence process, such as for example atomic layer deposition (ALD), can be used to form a dielectric containing gadolinium oxide and scandium oxide. In an embodiment, a dielectric structure can be formed b…
Who is the assignee on this patent?
Micron Technology Inc
What technology area does this patent fall under?
Primary CPC classification H10P14/69396. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).