Elemental semiconductor material contact for GaN-based light emitting diodes

US8933434B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8933434-B2
Application numberUS-201313897508-A
CountryUS
Kind codeB2
Filing dateMay 20, 2013
Priority dateMay 20, 2013
Publication dateJan 13, 2015
Grant dateJan 13, 2015

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A vertical stack including a p-doped GaN portion, a multi-quantum-well, and an n-doped GaN portion is formed on an insulator substrate. The p-doped GaN portion may be formed above, or below, the multi-quantum-well. A dielectric material liner is formed around the vertical stack, and is patterned to physically expose a top surface of the p-doped GaN portion. A selective low temperature epitaxy process is employed to deposit a semiconductor material including at least one elemental semiconductor material on the physically exposed surfaces of the p-doped GaN portion, thereby forming an elemental semiconductor material portion. Metallization is performed on a portion of the elemental semiconductor material portions to form an electrical contact structure that provides effective electrical contact to the p-doped GaN portion through the elemental semiconductor material portion. The elemental semiconductor material portion spreads electrical current between the electrical contact structure and the p-doped GaN portion.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductor structure comprising: a vertical stack located on a substrate, said vertical stack comprising, from bottom to top: a first GaN portion having a doping of a first conductivity type, a multi-quantum well located on said first GaN portion, and a second GaN portion located on said multi-quantum well and having a doping of a second conductivity type that is the opposite of said first conductivity type, wherein one of said first…

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What does patent US8933434B2 cover?
A vertical stack including a p-doped GaN portion, a multi-quantum-well, and an n-doped GaN portion is formed on an insulator substrate. The p-doped GaN portion may be formed above, or below, the multi-quantum-well. A dielectric material liner is formed around the vertical stack, and is patterned to physically expose a top surface of the p-doped GaN portion. A selective low temperature epitaxy p…
Who is the assignee on this patent?
IBM, Internat Business Machines Company
What technology area does this patent fall under?
Primary CPC classification H10H20/825. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).