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Curable composition for imprint, pattern-forming method and pattern
US8933144B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8933144-B2 |
| Application number | US-201414212807-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 14, 2014 |
| Priority date | Sep 27, 2011 |
| Publication date | Jan 13, 2015 |
| Grant date | Jan 13, 2015 |
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Abstract
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Provide a curable composition for imprint, which is improved in the surface roughness of the cured film. A curable composition for imprint comprising a polymerizable compound (A), a polymerization initiator (B), and a non-polymerizable compound (C), the non-polymerizable compound (C) comprising at least one species of surfactant (C1) which contains 20% by mass or more of fluorine atom, and, at least one species of polymer (C2) which contains 3% by mass or more and less than 20% by mass of fluorine atom and/or 5% by mass or more and less than 40% by mass of silicon atom, and has a weight-average molecular weight (Mw) of 1,000 to 100,000.
First claim
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The invention claimed is: 1. A curable composition for imprint comprising a polymerizable compound (A), a polymerization initiator (B), and a non-polymerizable compound (C), the non-polymerizable compound (C) comprising at least one species of surfactant (C1) which contains 20% by mass or more of fluorine atom, and, at least one species of polymer (C2) which contains 3% by mass or more and less than 20% by mass of fluorine atom and/or 5% by mass or more and less than 40% by mass o…
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- What does patent US8933144B2 cover?
- Provide a curable composition for imprint, which is improved in the surface roughness of the cured film. A curable composition for imprint comprising a polymerizable compound (A), a polymerization initiator (B), and a non-polymerizable compound (C), the non-polymerizable compound (C) comprising at least one species of surfactant (C1) which contains 20% by mass or more of fluorine atom,…
- Who is the assignee on this patent?
- Fujifilm Corp
- What technology area does this patent fall under?
- Primary CPC classification C08F2/44. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jan 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).