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US-2024400824-A1 · Dec 5, 2024 · US
Polyamide blend molding compound
US8932693B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8932693-B2 |
| Application number | US-84579710-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 29, 2010 |
| Priority date | Jul 31, 2009 |
| Publication date | Jan 13, 2015 |
| Grant date | Jan 13, 2015 |
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Abstract
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Polyamide blend molding compound, includes a polyamide blend content and at least one impact-resistant component, characterized in that the polyamide blend content includes the following polyamides: (A) 20 to 65% by weight of at least one semi-crystalline polyamide with an enthalpy of fusion >40 J/g and with an average of at least 8 C atoms per monomeric unit; (B) 8 to 25% by weight of at least one amorphous and/or microcrystalline polyamide, with the microcrystalline polyamide having an enthalpy of fusion in the range of 4 to 40 J/g, and (C) 1 to 20% by weight of at least one polyamide with an average of a maximum of 6 C atoms per monomeric unit. The impact-resistant component includes as follows: (D) 10 to 40% by weight of a polyamide elastomer which is composed of hard segments and soft segments, with the hard segments being based on lactams and/or amino-carboxylic acids, and (E) 0 to 35% by weight of a non-polyamide elastomer.
First claim
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The invention claimed is: 1. A polyamide blend molding compound, comprising a polyamide blend content and at least one impact-resistant component, wherein the polyamide blend content comprises the following polyamides: (A) 25 to 50% by weight of at least one semi-crystalline polyamide with an enthalpy of fusion >40 J/g and with an average of at least 8 C atoms per monomeric unit selected from the group consisting of PA 610, PA 612, PA 1010, PA 106, PA 106/10T, PA 614 and PA 618;…
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Chemistry & Metallurgy · mapped topic
Cross-Sectional Technologies · mapped topic
Chemistry & Metallurgy · mapped topic
Cross-Sectional Technologies · mapped topic
Chemistry & Metallurgy · mapped topic
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- What does patent US8932693B2 cover?
- Polyamide blend molding compound, includes a polyamide blend content and at least one impact-resistant component, characterized in that the polyamide blend content includes the following polyamides: (A) 20 to 65% by weight of at least one semi-crystalline polyamide with an enthalpy of fusion >40 J/g and with an average of at least 8 C atoms per monomeric unit; (B) 8 to 25% by weight of at least…
- Who is the assignee on this patent?
- Hoffmann Botho, Kettl Ralph, Ems Patent Ag
- What technology area does this patent fall under?
- Primary CPC classification C08L77/06. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jan 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).