Method for producing an SMC multi-layer component

US8932499B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8932499-B2
Application numberUS-201113636394-A
CountryUS
Kind codeB2
Filing dateMar 16, 2011
Priority dateMar 25, 2010
Publication dateJan 13, 2015
Grant dateJan 13, 2015

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  2. Abstract

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Abstract

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Method for producing an SMC multi-layer component in a production process. The component has a sandwich structure. At least one foam material layer ( 3 ) is embedded between two SMC cover layers ( 2, 2′ ). An insert layer arrangement comprising at least one first and one second SMC semifinished product cover layer ( 2, 2′ ) is positioned in a press mold comprising a punch ( 1 ) and a die ( 1′ ). A first and a second SMC semifinished product cover layers ( 2, 2′ ) are shaped into two SMC cover layers ( 2, 2′ ) by applying pressure to the layer arrangement. Curing of the first and the second SMC semifinished product cover layers ( 2, 2′ ) is initiated. The punch ( 1 ) and the die ( 1′ ) are moved away from each other, until the distance provided therebetween corresponds to a thickness of the SMC multi-layer component to be produced. A foaming process of a material ( 3′ ) that can be foamed, which is provided between the two SMC cover layers ( 2, 2′ ) is initiated, producing the foam material layer ( 3 ). After the foaming has ended, the SMC multi-layer component is removed from the press mold.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for producing an SMC multi-layer component in a production process, wherein the component has a sandwich structure and at least one foam material layer ( 3 ) is embedded between two SMC cover layers ( 2 , 2 ′), comprising the steps of a) positioning an insert layer arrangement comprising at least one first and one second SMC semifinished product cover layer ( 2 , 2 ′) in a press mold comprising a punch ( 1 ) and a die ( 1 ′), b) shaping a…

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What does patent US8932499B2 cover?
Method for producing an SMC multi-layer component in a production process. The component has a sandwich structure. At least one foam material layer ( 3 ) is embedded between two SMC cover layers ( 2, 2′ ). An insert layer arrangement comprising at least one first and one second SMC semifinished product cover layer ( 2, 2′ ) is positioned in a press mold comprising a punch ( 1 ) and a die ( 1′ )…
Who is the assignee on this patent?
Goedecke Jens, Ilzhoefer Karl-Heinz, Daimler Ag
What technology area does this patent fall under?
Primary CPC classification B29C70/086. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).