Rinsing and drying for electrochemical processing
US-9222194-B2 · Dec 29, 2015 · US
Plating apparatus and plating method
US8932440B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8932440-B2 |
| Application number | US-201113136826-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 11, 2011 |
| Priority date | Sep 24, 2010 |
| Publication date | Jan 13, 2015 |
| Grant date | Jan 13, 2015 |
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Abstract
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[Problem] To provide a plating method and apparatus which do not require preparation of a separate treatment tank for each treatment step and therefore enable the facility to be reduced in size and, further, which can reduce the amounts of use of the treatment solutions. [Solution] A plating apparatus feeding a plating solution to a treatment tank in which an electrode is arranged and plating a workpiece made of a metal so as to perform plating, the plating apparatus characterized by being provided with a plurality of pipes which are connected to an outer wall of the treatment tank and a switch valve which is provided able to rotate at an inner side of the outer wall and which has at least one feed port for making at least one treatment solution feed pipe selected from the plurality of treatment solution feed pipes communicate with the treatment tank.
First claim
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The invention claimed is: 1. A plating apparatus plating a metal workpiece with running a current to the metal workpiece, comprising: a treatment tank to which a plating solution is fed; an electrode arranged in said treatment tank; a plurality of treatment solution feed pipes connected to an outer wall of said treatment tank; a switch valve; wherein said switch valve rotates at an inner side of said outer wall and has at least one feed port for making at least one treatme…
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Frequently asked questions
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- What does patent US8932440B2 cover?
- [Problem] To provide a plating method and apparatus which do not require preparation of a separate treatment tank for each treatment step and therefore enable the facility to be reduced in size and, further, which can reduce the amounts of use of the treatment solutions. [Solution] A plating apparatus feeding a plating solution to a treatment tank in which an electrode is arranged and pla…
- Who is the assignee on this patent?
- Shinyama Keiji, Uchida Tomoya, Denso Corp
- What technology area does this patent fall under?
- Primary CPC classification C25D17/00. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jan 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).