Methods for chemical mechanical polishing and forming interconnect structure
US-2024290629-A1 · Aug 29, 2024 · US
US8932110B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8932110-B2 |
| Application number | US-201113045918-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 11, 2011 |
| Priority date | Jul 6, 2010 |
| Publication date | Jan 13, 2015 |
| Grant date | Jan 13, 2015 |
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A method of manufacturing a perpendicular magnetic recording medium substrate is capable of reducing the waviness of all wavelength components and a recording medium is capable of reducing contact with a magnetic head to improve the flying stability of the magnetic head. The method includes two polishing operations. The first operation includes polishing a substrate having a Ni—P-based alloy underlayer with a first porous material that includes 0.1 wt % to 25 wt % of alumina, titania, silica, and zirconia abrasive while supplying a first slurry liquid including an organic or inorganic acid and a first abrasive to the underlayer of the substrate. The second operation includes polishing a surface of the underlayer polished in the first polishing with a second porous material while supplying a second slurry liquid including an organic or inorganic acid and a second abrasive with a grain diameter smaller than that of the first abrasive.
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What is claimed is: 1. A method of manufacturing a perpendicular magnetic recording medium substrate, comprising: first polishing a surface of an underlayer made of a Ni—P-based alloy with a first porous material, having an abrasive mixed in the first porous material prior to the first polishing in an amount that is in a range of from 3 wt % to 20 wt % of the weight of the first porous material, while supplying a first slurry liquid including an organic acid or an inorganic acid a…
Operations & Transport · mapped topic
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Chemistry & Metallurgy · mapped topic
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