Photonic device and method of making same
US-11892678-B2 · Feb 6, 2024 · US
US8929693B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8929693-B2 |
| Application number | US-201313787918-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 7, 2013 |
| Priority date | Jun 7, 2012 |
| Publication date | Jan 6, 2015 |
| Grant date | Jan 6, 2015 |
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Official abstract text for this publication.
A semiconductor package and a semiconductor device including the same. The semiconductor package includes: a package substrate; a plurality of connection elements that are disposed on the package substrate; and a semiconductor chip that includes at least one optical input/output element that transmits/receives an optical signal to/from the outside at an optical input/output angle with respect to a direction perpendicular to a bottom surface of the package substrate, and is electrically connected to the package substrate through the plurality of connection.
Opening claim text (preview).
What is claimed is: 1. A semiconductor package comprising: a package substrate; a plurality of connection elements that are disposed on the package substrate; and a semiconductor chip that is electrically connected to the package substrate through the plurality of connection elements, the semiconductor chip including an optical waveguide and at least one optical input/output element that is configured to pass an optical signal between the semiconductor chip and an element exte…
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