Heater assembly and method of heating

US8929016B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8929016-B2
Application numberUS-201313831206-A
CountryUS
Kind codeB2
Filing dateMar 14, 2013
Priority dateApr 26, 2012
Publication dateJan 6, 2015
Grant dateJan 6, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A magnetic recording head includes a magnetic writer comprising a main write pole and a return write pole. The magnetic recording head includes a write heater assembly comprising at least one first heater subassembly and at least one second heater subassembly. At least part of the magnetic write head is disposed between the first heater subassembly and the second heater subassembly. When the first heater subassembly, the second heater subassembly, and the magnetic writer are energized, a variation in the thermal protrusion of the head media interface of the magnetic recording head may be less than about 20 nm along the down track and/or cross track directions.

First claim

Opening claim text (preview).

What is claimed is: 1. A magnetic recording head, comprising: a magnetic write head including a near field transducer, a main write pole and a return write pole; and a write heater assembly comprising at least one first heater subassembly, at least one second heater subassembly, and at least one electrical connection configured to electrically connect a first resistive heating element of the first heater subassembly and a second resistive heating element of the second heater subassembly in series, wherein at least part of the near field transducer is disposed between the first heater subassembly and the second heater subassembly. 2. The magnetic recording head of claim 1 , wherein, in a frame of reference including a down track x axis and an orthogonal cross track y axis, the first heater subassembly is disposed at a first position along the x axis and the second heater subassembly is disposed at a second position along the x axis, different from the first position. 3. The magnetic recording head of claim 2 , wherein a variation in a protrusion profile of a head media interface of the magnetic recording head between the first heater subassembly and the second heater subassembly varies by less than about 20 nm when the first heater subassembly, the second heater subassembly and the magnetic write head are energized. 4. The magnetic recording head of claim 1 , wherein, in a frame of reference including a down track x axis and an orthogonal cross track y axis, when energized, the first heater subassembly is configured to cause a first thermal protrusion having a first maximum stroke displacement along a z axis normal to a head media interface, the first maximum stroke displacement occurring at a first protrusion location along the x axis and the second heater subassembly is configured to cause a second thermal protrusion having a second maximum stroke displacement along the z axis occurring at a second protrusion location along the x axis, wherein the first thermal protrusion location is different from the second thermal protrusion location along the x axis. 5. The magnetic recording head of claim 1 , wherein, in a frame of reference including a down track x axis and an orthogonal cross track y axis, the first heater subassembly is disposed at a first position along the y axis and the second heater subassembly is disposed at a second position along the y axis, different from the first position. 6. The magnetic recording head of claim 5 , wherein a variation in a protrusion profile of a head media interface of the magnetic recording head between the first heater subassembly and the second heater subassembly varies by less than about 20 nm when the first heater subassembly, the second heater subassembly and the magnetic write pole are energized. 7. The magnetic recording head of claim 1 , wherein, in a frame of reference including a down track x axis and an orthogonal cross track y axis, when energized, the first heater subassembly is configured to cause a first thermal protrusion having a first maximum stroke displacement along a z axis normal to a head media interface, the first maximum stroke displacement occurring at a first protrusion location along the y axis and the second heater subassembly is configured to cause a second thermal protrusion having a second maximum stroke displacement along the z axis occurring at a second protrusion location along the y axis, wherein the first thermal protrusion location is different from the second thermal protrusion location along the y axis. 8. The magnetic recording head of claim 1 , wherein a trace width of at least one of the first and second resistive heating elements is different from a trace width of the electrical connection. 9. The magnetic recording head of claim 1 , wherein a trace width of at least one of the first and second resistive heating elements is in a range of about 1 μm to about 20 μm. 10. The magnetic recording head of claim 1 , wherein a ratio between a trace width of at least one of the first and second resistive heating elements and a trace width of the electrical connection is between about 0.1 and 20. 11. The magnetic recording head of claim 1 , wherein a resistance of at least one of the first and second resistive heating elements is in a range of about 10Ω to about 70Ω. 12. The magnetic recording head of claim 1 , wherein a ratio between a resistance of at least one of the first and second resistive heating elements and a resistance of the electrical connection is between about 5 and 25. 13. The magnetic recording head of claim 1 , wherein a trace width of the first and second resistive heating elements is the same as a trace width of the electrical connection and a distance between the first or second resistive heating elements and a head media interface is less than a distance between the electrical connection and the head media interface. 14. The magnetic recording head of claim 8 , wherein the first and second resistive heating elements are positioned at a distance d r from a head media interface of the magnetic recording head and the electrical connection is positioned at a distance d c from the media facing surface and d r =d c . 15. The magnetic recording head of claim 1 , wherein at least one of the first heater subassembly and the second heater subassembly are positioned between the main write pole and the return write pole. 16. The magnetic recording head of claim 1 , further comprising: a read sensor, wherein the first heater subassembly is positioned proximate the read sensor and the second heater subassembly is positioned proximate the magnetic write head. 17. A magnetic recording head, comprising: a magnetic write head comprising a main write pole and a near field transducer; and a write heater assembly comprising at least one first heater subassembly, at least one second heater subassembly, and at least one electrical connection configured to electrically connect a first resistive heating element of the first heater subassembly and a second resistive heating element of the second heater subassembly in series, wherein the near field transducer is disposed between the first heater subassembly and the second heater subassembly. 18. A method, comprising: energizing at least a first heater subassembly and a second heater subassembly of a magnetic recording head, the first heater subassembly comprises a first resistive heating element and the second heater subassembly comprises a second resistive heating element and at least one electrical connection is configured to electrically connect the first resistive heating element and the second resistive heating element in series, the energizing of the first heater subassembly creating a first thermal protrusion at a first location of a head-media interface of the magnetic recording head and the energizing of the second heater subassembly creating a second protrusion at a second location of the head media interface of the magnetic recording head; energizing a write head of the magnetic recording head, the energizing of the write head creating a near field transducer thermal protrusion at the head media interface of the magnetic recording head, wherein a location of the near field transducer thermal protrusion is between the a first location and the second location. 19. The method of claim 18 , wherein energizing the write head comprises energizing at least one of a magnetic write pole and a near field transducer of the magnetic recording head.

Assignees

Inventors

Classifications

  • Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title

  • G11B13/08Primary

    using near-field interactions or transducing means and at least one other method or means for recording or reproducing · CPC title

  • G11B5/3133Primary

    including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure (G11B5/3106 takes precedence) · CPC title

  • where the layers are extra layers normally not provided in the transducing structure, e.g. optical layers (G11B5/3196 takes precedence) · CPC title

  • using thermal means · CPC title

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What does patent US8929016B2 cover?
A magnetic recording head includes a magnetic writer comprising a main write pole and a return write pole. The magnetic recording head includes a write heater assembly comprising at least one first heater subassembly and at least one second heater subassembly. At least part of the magnetic write head is disposed between the first heater subassembly and the second heater subassembly. When the fi…
Who is the assignee on this patent?
Seagate Technology Llc
What technology area does this patent fall under?
Primary CPC classification G11B13/08. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).