Electronic package module and method for fabrication of the same
US-2024413067-A1 · Dec 12, 2024 · US
Lead frame semiconductor device
US8928136B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8928136-B2 |
| Application number | US-201213659557-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 24, 2012 |
| Priority date | Oct 31, 2011 |
| Publication date | Jan 6, 2015 |
| Grant date | Jan 6, 2015 |
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Abstract
Official abstract text for this publication.
A lead frame includes: a chip-mounting region provided on a front surface; a lead region including a plurality of concave and convex sections arranged in an in-plane direction of the chip-mounting region; and a terminal arranged in the concave section. A thickness of the lead region from the front surface is smaller than a thickness of the terminal from the front surface.
First claim
Opening claim text (preview).
What is claimed is: 1. A lead frame comprising: a chip-mounting region, a semiconductor chip being mountable onto a front surface of the lead frame in said chip-mounting region; a terminal electrically connectable to said semiconductor chip through a first wire, a gap along an in-plane direction being between said chip-mounting region and said terminal; and a lead region electrically connectable to said semiconductor chip through a second wire, said lead region extending in sa…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8928136B2 cover?
- A lead frame includes: a chip-mounting region provided on a front surface; a lead region including a plurality of concave and convex sections arranged in an in-plane direction of the chip-mounting region; and a terminal arranged in the concave section. A thickness of the lead region from the front surface is smaller than a thickness of the terminal from the front surface.
- Who is the assignee on this patent?
- Sony Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W74/014. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).