Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
Semiconductor packaging for a memory device and a fabricating method thereof
US8928129B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8928129-B2 |
| Application number | US-201213550186-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 16, 2012 |
| Priority date | Aug 16, 2011 |
| Publication date | Jan 6, 2015 |
| Grant date | Jan 6, 2015 |
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Abstract
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A semiconductor device includes a substrate, a semiconductor chip, a first molding member and a metal layer. The substrate includes a first ground pad formed therein, the first ground pad having a first exposed surface exposed at a first surface of the substrate. The semiconductor chip is formed on the first surface of the substrate. The first molding member is formed on the first surface of the substrate and covers the semiconductor chip while not covering the first exposed surface. The metal layer covers the first molding member and extends to lateral surfaces of the substrate while contacting the first exposed surface.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor device, comprising: a substrate including a first ground pad formed therein, the first ground pad having a first exposed surface exposed at a first surface of the substrate; a semiconductor chip formed on the first surface of the substrate; a first molding member formed on the first surface of the substrate and covering the semiconductor chip while not covering the first exposed surface; and a metal layer covering the first molding memb…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8928129B2 cover?
- A semiconductor device includes a substrate, a semiconductor chip, a first molding member and a metal layer. The substrate includes a first ground pad formed therein, the first ground pad having a first exposed surface exposed at a first surface of the substrate. The semiconductor chip is formed on the first surface of the substrate. The first molding member is formed on the first surface of th…
- Who is the assignee on this patent?
- Song In-Sang, Samsung Electronics Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W42/20. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).