Power integrated circuit including series-connected source substrate and drain substrate power MOSFETs

US8928075B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8928075-B2
Application numberUS-201213563923-A
CountryUS
Kind codeB2
Filing dateAug 1, 2012
Priority dateAug 4, 2011
Publication dateJan 6, 2015
Grant dateJan 6, 2015

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A semiconductor device containing a high voltage MOS transistor with a drain drift region over a lower drain layer and channel regions laterally disposed at the top surface of the substrate. RESURF trenches cut through the drain drift region and body region parallel to channel current flow. The RESURF trenches have dielectric liners and electrically conductive RESURF elements on the liners. Source contact metal is disposed over the body region and source regions. A semiconductor device containing a high voltage MOS transistor with a drain drift region over a lower drain layer, and channel regions laterally disposed at the top surface of the substrate. RESURF trenches cut through the drain drift region and body region perpendicular to channel current flow. Source contact metal is disposed in a source contact trench and extended over the drain drift region to provide a field plate.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductor device, comprising: a semiconductor substrate; a high voltage metal oxide semiconductor (MOS) transistor, including: a heavily doped lower drain layer in said substrate, said lower drain layer having a first conductivity type with an average doping density greater than 1×10 19 cm −3 ; a drain drift region disposed over said lower drain layer, said drain drift region having said first conductivity type with an average doping density betw…

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What does patent US8928075B2 cover?
A semiconductor device containing a high voltage MOS transistor with a drain drift region over a lower drain layer and channel regions laterally disposed at the top surface of the substrate. RESURF trenches cut through the drain drift region and body region parallel to channel current flow. The RESURF trenches have dielectric liners and electrically conductive RESURF elements on the liners. Sou…
Who is the assignee on this patent?
Kocon Christopher Boguslaw, Denison Marie, Efland Taylor, and 1 more
What technology area does this patent fall under?
Primary CPC classification H10D64/112. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).