Light emitting device package comprising a lead electrode exposed to a recessed bottom portion of the package body

US8928008B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8928008-B2
Application numberUS-201113114946-A
CountryUS
Kind codeB2
Filing dateMay 24, 2011
Priority dateNov 25, 2008
Publication dateJan 6, 2015
Grant dateJan 6, 2015

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductor light emitting device package, comprising: metal layers having at least two lead electrodes, the metal layers disposed to be spaced apart from each other; a semiconductor light emitting device on at least one of the at least two lead electrodes; a package body having an upper surface, a lower surface, and a cavity between the upper surface and the lower surface; and a molding layer disposed on the semiconductor light emitting device,…

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Next steps

Free tools are coming soon. Tell us what you want to track and we'll notify you.

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US8928008B2 cover?
A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed wi…
Who is the assignee on this patent?
Kim Wan Ho, Park Jun Seok, Lg Innotek Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10H20/8506. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).