Optoelectronic component and method for producing same
US-12176444-B2 · Dec 24, 2024 · US
US8928008B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8928008-B2 |
| Application number | US-201113114946-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 24, 2011 |
| Priority date | Nov 25, 2008 |
| Publication date | Jan 6, 2015 |
| Grant date | Jan 6, 2015 |
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Official abstract text for this publication.
A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.
Opening claim text (preview).
What is claimed is: 1. A semiconductor light emitting device package, comprising: metal layers having at least two lead electrodes, the metal layers disposed to be spaced apart from each other; a semiconductor light emitting device on at least one of the at least two lead electrodes; a package body having an upper surface, a lower surface, and a cavity between the upper surface and the lower surface; and a molding layer disposed on the semiconductor light emitting device,…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Electricity · mapped topic
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