Method of making metal substrates with structures formed therein
US-2024404922-A1 · Dec 5, 2024 · US
Thermal pad and method of forming the same
US8927872B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8927872-B2 |
| Application number | US-200913202209-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 20, 2009 |
| Priority date | Feb 20, 2009 |
| Publication date | Jan 6, 2015 |
| Grant date | Jan 6, 2015 |
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- Title
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Abstract
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A thermal pad ( 602, 612, 622, 702, 712 ) formed on a Printed Circuit Board and a method ( 900 ) of formed the thermal pad ( 602, 612, 622, 702, 712 ) are provided. The thermal pad ( 602, 612, 622, 702, 712 ) comprises in its interior one or more coins ( 604, 614, 624, 704, 714 ) has a height equal to a thickness of the PCB, and is made of metal or alloy, inserted into a corresponding one of one or more plated cutouts straight through the PCB in the thermal pad, and bonded to side walls of the corresponding one of the one or more plated cutouts with a paste capable of resisting a temperature of 250° C. or above. The plurality of through via ( 606, 616, 626, 706, 716 ) are plated, and lugged with a solder mask. The thermal pad ( 602, 612, 622, 702, 712 ) has a flat top surface and a flat bottom surface, either of which is coplanar with a corresponding one of top and bottom surfaces of the PCB. A PCB having formed thereon the above thermal pad ( 602, 612, 622, 702, 712 ) is also provided.
First claim
Opening claim text (preview).
The invention claimed is: 1. A thermal pad formed on a printed circuit board (PCB), the thermal pad comprising in its interior: a coin, wherein: i) the coin has a height equal to a thickness of the PCB, ii) the coin is made of metal or alloy, iii) the coin is inserted into a corresponding plated cutout straight through the PCB in the thermal pad, wherein the cutout is essentially the same size as the coin, and iv) the coin is bonded to side walls of the corresponding cutout with a…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H10W40/228Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8927872B2 cover?
- A thermal pad ( 602, 612, 622, 702, 712 ) formed on a Printed Circuit Board and a method ( 900 ) of formed the thermal pad ( 602, 612, 622, 702, 712 ) are provided. The thermal pad ( 602, 612, 622, 702, 712 ) comprises in its interior one or more coins ( 604, 614, 624, 704, 714 ) has a height equal to a thickness of the PCB, and is made of metal or alloy, inserted into a corresponding one of on…
- Who is the assignee on this patent?
- Zhang Guangjun, Xie Yuanchun, Ericsson Telefon Ab L M
- What technology area does this patent fall under?
- Primary CPC classification H10W40/228. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).