Suspension board with circuit and producing method thereof
US-2016270216-A1 · Sep 15, 2016 · US
Suspension board with circuit and producing method thereof
US8927870B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8927870-B2 |
| Application number | US-201313763232-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 8, 2013 |
| Priority date | Mar 5, 2009 |
| Publication date | Jan 6, 2015 |
| Grant date | Jan 6, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.
First claim
Opening claim text (preview).
What is claimed is: 1. A producing method of a suspension board with circuit, wherein the suspension board with circuit comprises an insertion portion configured to be inserted into an E-block, and wherein the insertion portion is defined along an entire widthwise direction of the suspension board with circuit, the producing method comprising the steps of: preparing a metal supporting board and an insulating base layer formed on the metal supporting board; forming a conducti…
Assignees
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Classifications
- G11B5/4846Primary
Physics · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8927870B2 cover?
- A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the in…
- Who is the assignee on this patent?
- Nitto Denko Corp
- What technology area does this patent fall under?
- Primary CPC classification G11B5/4846. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Jan 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).