Polyamide resin

US8927647B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8927647-B2
Application numberUS-200913119262-A
CountryUS
Kind codeB2
Filing dateSep 15, 2009
Priority dateSep 18, 2008
Publication dateJan 6, 2015
Grant dateJan 6, 2015

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A polyamide resin composed of constitutional units derived from a diamine component 70 mol % or more of which is derived from p-xylylenediamine and constitutional unit derived from a dicarboxylic acid 70 mol % or more of which is derived from an aliphatic dicarboxylic acid having 6 to 18 carbon atoms. The polyamide resin has a number average molecular weight (Mn) of 10,000 to 50,000 and a degree of dispersion (weight average molecular weight/number average molecular weight=Mw/Mn) satisfying the following formula (1): 1.5≦(Mw/Mn)≦6.0, wherein Mw and Mn are determined by gel permeation chromatography (GPC).

First claim

Opening claim text (preview).

What is claimed is: 1. A polyamide resin, comprising: a constitutional unit derived from diamine component, and a constitutional unit derived from dicarboxylic acid component, wherein 70 mol % or more of the constitutional unit derived from the diamine component is derived from p-xylylenediamine, 70 mol % or more of the constitutional unit derived from dicarboxylic acid component is derived from an aliphatic dicarboxylic acid having 6 to 10 carbon atoms, a number average molecular weight (Mn) is from 10,000 to 50,000, and a degree of dispersion expressed by Mw/Mn=weight average molecular weight/number average molecular weight satisfies formula (1) 1.5≦(Mw/Mn)≦3.0  (1), wherein Mn and Mw are determined by a gel permeation chromatography (GPC). 2. The polyamide resin according to claim 1 , wherein a relative viscosity is from 1.80 to 4.20 when determined with a solution in concentrated sulfuric acid in a concentration of 1 g/100 mL at 25° C. 3. The polyamide resin according to claim 1 , wherein the aliphatic dicarboxylic acid is at least one acid selected from the group consisting of adipic acid, azelaic acid, and sebacic acid. 4. The polyamide resin according to claim 1 , wherein retention of melt viscosity (%) after the polyamide resin is maintained in a molten state at a temperature higher than a melting point of the polyamide resin by 10 to 50° C. for 30 min satisfies formula (2) 70<( a/b )×100<130  (2), wherein a is a melt viscosity (Pa·s) after maintained in a molten state for 30 min and b is a melt viscosity (Pa·s) after 2.5 min from starting the melting. 5. A polyamide resin composition, comprising: 100 parts by weight of the polyamide resin as defined in claim 1 , 0 to 30 parts by weight of an nucleating agent for crystallization, and 10 to 150 parts by weight of inorganic filler. 6. The polyamide resin according to claim 2 , wherein the aliphatic dicarboxylic acid is at least one acid selected from the group consisting of adipic acid, azelaic acid, and sebacic acid. 7. The polyamide resin according to claim 2 , wherein retention of melt viscosity (%) after the polyamide resin is maintained in a molten state at a temperature higher than a melting point of the polyamide resin by 10 to 50° C. for 30 min satisfies formula (2) 70<( a/b )×100<130  (2), wherein a is a melt viscosity (Pa·s) after maintained in a molten state for 30 min and b is a melt viscosity (Pa·s) after 2.5 min from starting the melting. 8. The polyamide resin according to claim 3 , wherein retention of melt viscosity (%) after the polyamide resin is maintained in a molten state at a temperature higher than a melting point of the polyamide resin by 10 to 50° C. for 30 min satisfies formula (2) 70<( a/b )×100<130  (2), wherein a is a melt viscosity (Pa·s) after maintained in a molten state for 30 min and b is a melt viscosity (Pa·s) after 2.5 min from starting the melting. 9. The polyamide resin according to claim 1 , wherein 90 mol % or more of the constitutional unit derived from the diamine component is derived from p-xylylenediamine.

Assignees

Inventors

Classifications

  • derived from polyamines and polycarboxylic acids · CPC title

  • from at least two different diamines or at least two different dicarboxylic acids · CPC title

  • C08L77/06Primary

    Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US8927647B2 cover?
A polyamide resin composed of constitutional units derived from a diamine component 70 mol % or more of which is derived from p-xylylenediamine and constitutional unit derived from a dicarboxylic acid 70 mol % or more of which is derived from an aliphatic dicarboxylic acid having 6 to 18 carbon atoms. The polyamide resin has a number average molecular weight (Mn) of 10,000 to 50,000 and a degre…
Who is the assignee on this patent?
Kanda Tomomichi, Kuwahara Hisayuki, Ogawa Shun, and 3 more
What technology area does this patent fall under?
Primary CPC classification C08L77/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).